Tektronix' Advanced Measurement Solution Enables VIA Technologies to Drive Innovation
VIA Technologies Selects Tektronix Logic Analyzers and Oscilloscopes for High Speed Serial Data Design Validation and Interoperability Testing
PRNewswire-FirstCall
BEAVERTON, Ore.

Tektronix, Inc. , a leading worldwide provider of test, measurement and monitoring instrumentation, announced that VIA Technologies, Inc., a leading developer of silicon chip technologies and platform solutions, has selected digital systems analysis tools from Tektronix to develop digital products based upon serial data standards such as second-generation PCI-Express and SATA III. The integrated Tektronix solution, consisting of TLA7000 logic analyzers and ultra-high-performance TDS6000 oscilloscopes, will enable VIA's engineers to perform design validation, and comprehensive interoperability and compliance testing on digital products based on PCI-Express and SATA III specifications.

For its measurement needs VIA selected the new Tektronix TLA7012 and TLA7016 logic analyzers, the 12 GHz TDS6124C oscilloscope and the 15 GHz TDS6154C, the fastest real-time oscilloscope in the world. TLA7000 Series Logic Analyzers include the iLink™ Tool Set which seamlessly integrates the logic analyzer with an oscilloscope to provide instant digital and analog insight, and radically speeds the debugging of multiple signals.

"VIA has kept ahead of the industry through anticipating appropriate upcoming technologies and implementing them either as discrete silicon or integrated into the widest range of core logic chipsets in the industry," said Chewei Lin, Vice President of Product Marketing at VIA Technologies, Inc. "High-speed serial buses such as second-generation PCI Express and SATAIII present new challenges when making design and compliance measurements. The combination of TLA7000 logic analyzers and TDS6000 oscilloscopes from Tektronix supports our measurement needs at each stage of design, validation, compliance and debug, and will enable our engineers to test high-speed serial designs with total confidence."

"VIA Technologies has a distinguished history of innovation and we are delighted that they have again selected Tektronix' measurement solutions to drive development of their next generation products," said Bob Agnes, Vice President of Tektronix Asia Pacific Sales and Operations. "These ultra-high-performance Tektronix instruments will enable VIA's engineers to resolve validation and compliance issues quickly and efficiently, reducing time-to-market while ensuring world class levels of product quality and reliability."

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs, motherboard vendors and system integrators www.via.com.tw .

About Tektronix

Tektronix, Inc. is a test, measurement, and monitoring company providing measurement solutions to the communications, computer, and semiconductor industries worldwide. With more than 55 years of experience, Tektronix enables its customers to design, build, deploy, and manage next-generation global communications networks and advanced technologies. Headquartered in Beaverton, Oregon, Tektronix has operations in 19 countries worldwide. Tektronix' Web address is www.tektronix.com.

SOURCE: Tektronix, Inc.

CONTACT: Eric Xu of Tektronix, Inc., 86-21-50312000, or
eric.xu@tektronix.com


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