BEAVERTON, Ore., January 5, 2011— Tektronix Component Solutions announced today that its ASIC design and custom IC packaging services are now validated by IBM Corporation as “Ready for IBM Technology” on silicon germanium (SiGe) 5HP, 7HP, 7WL, and 8HP process technologies. Receiving this validation demonstrates that Tektronix Component Solutions offers customers the expertise, value and reliability required for high-performance SiGe devices.
“We’ve worked with IBM’s process for 15 years, designing and packaging over 30 SiGe ASICs across multiple technology nodes,” said Tom Buzak, president, Tektronix Component Solutions. “The validation from IBM is a significant benchmark for Tektronix Component Solutions’ ASIC design and IC packaging services.” he said.
About the “Ready for IBMTechnology” program
The “Ready for IBM Technology” program is a collaborative ecosystem of companies that enables IBM to complement its semiconductor capabilities and provide complete foundry solutions to clients. This ecosystem helps IBM 's foundry customers speed time-to-market, reduce development risk, lower development costs, and improve return on investment by identifying IP, design and manufacturing solutions and services that have been tested and validated for compatibility with IBM Foundry technologies . IBM business partners support a comprehensive set of solutions, including RF design services, digital design services, libraries, mixed signal IP cores, nonvolatile memory, reference flows, simulation tools, test and packaging services. The Ready for IBM Technology foundry program was launched in 2002, and since that time over 30 companies have been awarded Ready for IBM Technology.
ASIC Design Services
Tektronix Component Solutions has over 40 in-house ASIC designers developing high-complexity ASICs for customers and Tektronix instruments. The organization’s depth of experience in SiGe enables customers to reduce the risk inherent in complex IC development projects while achieving next-generation performance levels. From circuit and physical design to product engineering and foundry relationship management, Tektronix Component Solutions’ capabilities provide a turnkey option for ASIC development and a seamless connection to IC packaging services. Tektronix Component Solutions designs performance ASICs for the measurement, military, aerospace, and high-speed communications markets, with a focus on signal acquisition, generation, conversion, and conditioning.
IC Packaging Services
Complementing these ASIC design capabilities, Tektronix Component Solutions has over 60 engineers and 32,000 square feet of Class 10,000 manufacturing devoted to the development, assembly and test of high-performance custom IC packages and modules, including devices for classified defense programs. With an emphasis on low-volume, high-complexity applications, the organization leverages deep experience across a broad base of material, process and interconnect technologies to meet the performance, reliability and quality requirements of customers in the instrumentation, military, aerospace, medical and high-speed communications markets.
To learn more about Tektronix Component Solutions’ ASIC design and IC packaging services, please call 1-800-462-9835, email email@example.com, or visit component-solutions.tektronix.com.
About Tektronix Component Solutions
Tektronix Component Solutions, formerly known as Maxtek, is a proven microelectronics services provider offering a complete range of custom design, prototyping, manufacturing, and test services to equipment manufacturers. With more than 40 years of experience serving the measurement, military, medical, and communications markets, Tektronix Component Solutions works as an extension of our customers’ product teams to cost-effectively resolve the most demanding ASIC design, packaging, and interconnect challenges. Headquartered in Beaverton, Oregon, Tektronix Component Solutions can be found on the web at component-solutions.tektronix.com.
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